Although fans, heat sinks, or larger PCBs can provide additional thermal headroom, they also increase system cost, size, and complexity. As a result, engineers are looking for components that maintain reliable operation under elevated temperatures while providing greater flexibility in system design.
More design freedom, less cooling effort
This is exactly where OMRON's G6K-T1 Series comes into play. Specifically developed for applications combining high component density with elevated operating temperatures, these signal relays support ambient temperatures of up to 125°C. Compared with conventional signal relays, they provide significantly greater thermal design margin, helping engineers reduce - or even eliminate - the need for additional cooling measures.
For developers, this means:
- Greater thermal headroom in densely populated PCB designs
- Simplified thermal management
- Reduced need for fans or heat sinks
- More compact and cost-efficient system architectures
High switching performance in a compact footprint
Beyond their extended temperature capability, the G6K-T1 relays combine a compact footprint of just 10 × 6.5 × 5.2 mm with switching currents of up to 2 A. This makes them an ideal choice for applications that previously required larger relays or more elaborate thermal management solutions. At the same time, they retain the inherent advantages of electromechanical relays, including galvanic isolation, ultra-low leakage current, and straightforward circuit implementation.
To accommodate different system requirements, the G6K-T1 family is available in single-side stable and single-winding latching versions, as well as in SMT and through-hole packages. -Y variants additionally provide an impulse withstand voltage of up to 2.5 kV between the coil and contacts, offering enhanced robustness in demanding environments.
Designed for high-density electronic systems
The benefits of the G6K-T1 Series become particularly evident in applications where high integration density and long-term reliability are equally critical. Typical application areas include:
- Semiconductor test equipment
- Test and measurement instruments
- HVAC and building automation
- Security and access control systems
- Industrial automation and motor control
- Telecommunications equipment
Especially in modern IoT-enabled devices, where PCB real estate is increasingly limited, high-temperature relays help engineers maintain sufficient thermal design margin while continuing to drive product miniaturization.
High-temperature capability becomes the new design standard
As electronic systems continue to increase in power density, components must become not only smaller but also more thermally robust. High-temperature relays are therefore evolving from a niche solution into a key design requirement for next-generation electronic equipment.
With the G6K-T1 Series, OMRON enables developers to address this trend today. Greater thermal design flexibility, lower overall system costs, and the ability to realize compact, fanless equipment provide long-term advantages throughout the entire product lifecycle - from initial development to volume production.
Key Facts
- Signal relays for ambient temperatures up to 125 °C
- Compact footprint: 10 × 6.5 × 5.2 mm
- Switching currents up to 2 A
- DPDT (2 Form C) contact configuration
- Available as single-side stable and single-winding latching versions
- SMT and through-hole package options
- -Y variants with up to 2.5 kV impulse withstand voltage
- Low power consumption of approximately 140 mW
- Ideal for test & measurement, industrial automation, HVAC, building automation, and telecommunications
- Available now from Rutronik at www.rutronik24.com
For more information to the G6K-T1 signal relays by OMRON and a direct ordering option, please visit our e-commerce platform at www.rutronik24.com. |
Contact Rutronik:
| Norman Majer | Corporate Product Manager Mechanics | + 49 7231 801 4833 | norman.majer@rutronik.com |