About Bosch semiconductors and sensors
For our semiconductors, we combine Bosch's deep expertise in mobility and industrial systems with more than 60 years of specific semiconductor know-how. This unique system understanding allows us to develop, produce, and market superior electronic systems and semiconductor components that are an ideal fit for their respective target applications - across automotive, industrial, and beyond.
Bosch semiconductors and sensors stands for future-oriented technologies: we continuously invest in research, production, and development to pioneer new processes and solutions for next-generation semiconductors. Our innovations in MEMS (Micro-Electro-Mechanical Systems), ICs, and power semiconductors such as SiC (silicon carbide) chips have made us one of the world's leading semiconductor and sensor suppliers. By 2035, we expect new vehicles alone to include more than 40 of our chips on average.
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New Product Information
SiC discrete QDPAK
Designed for maximum scalability
Bosch’s QDPAK is a top side cooled (TSC) package designed for high-power discrete products in automotive applications. Engineered for performance and space efficiency, it offers:
- Compact footprint: 15 mm x 21.6 mm (≈314 mm²)
- JEDEC-compliant design: Ensures compatibility and reliability
- High power density: Enables advanced functions like bi-directional switching
- Enhanced cooling: Reduces system costs and improves efficiency
- Space-saving layout: Minimizes PCB requirements for additional cost benefits
Ideal for modern automotive electronics, our QDPAK combines robust thermal management with optimized size, delivering superior performance in demanding environments.
Featured Products
SMA380 | Low-latency acceleration sensor for road noise cancellation
Ultra compact
The SMA380 is a 3-axis accelerometer with TDM and I²C interfaces, designed for road noise cancellation.
It enhances driving comfort by detecting and processing vibrations from road noise with low latency. Power and digital communication can be supplied by different sources, allowing more flexible system power architectures.
SMA286 | High-bandwidth acceleration sensor for vibration monitoring
Ultra compact
The SMA286 vibration monitoring sensor is a high-bandwidth device with TDM and SPI interfaces, designed for precise vibration measurement.
It is essential for predictive maintenance and condition monitoring, enabling early detection of potential issues and optimizing equipment performance. The sensor integrates seamlessly into various systems, providing accurate data and ensuring effective monitoring with minimal latency.
SMI240 | Inertial sensor with ASIL B for semi-autonomous driving
For hands-free driving detects changes in the vehicle position
SMI240 is a 6in1 inertial sensor with ASIL B rating. The sensor is capable of measuring all 6 degrees of freedom: yaw/pitch/roll rate and acceleration in x/y/z directions.
Typical applications include L2 semi-autonomous driving, hands-free driving and positioning applications.
SMI330 | Combined inertial sensor for non-safety relevant applications
Enhance navigation with ultra-low-power sensing
The SMI330 is an ultra-low-power inertial sensor designed specifically for navigation, telematics, always-on applications, and vehicle security.
Engineered for exceptional efficiency, the SMI330 delivers precise 6-axis motion data while minimizing power consumption. Its outstanding flexibility, including configurable power modes and a wide range of hardware settings, makes it an ideal choice for versatile, power-sensitive systems.
SMI980 | High performance inertial sensor for ADAS systems
Robust Inertial Sensing for demanding applications
SMI980 is a low-noise, 6-channel inertial sensor engineered for a high standard of performance, safety, and reliability. Designed specifically for demanding applications like inertial navigation and autonomous vehicles, the SMI980 provides the precision data required for the future of mobility and automation.
Its qualification for ASIL D systems and robust design for zone ECU integration make it the trusted choice for safety-critical applications.
Product Range
MEMS Sensors
MEMS sensors for automotive applications – technology from Bosch for safer and smarter vehicles Automotive MEMS (Micro-Electro-Mechanical Systems) sensors are the key to many vehicle components, including airbag and vehicle dynamics systems, driver assistance systems, adaptive chassis control, navigation, and seat comfort. They are also enablers for highly automated driving, motion detection, and gesture recognition.
MEMS sensor key applications
MEMS sensors from Bosch are essential for various applications in safety systems. They detect vehicle deceleration for airbag deployment, measure rotation and lateral acceleration in vehicle dynamics control, and monitor tire pressure in Tire Pressure Monitoring Systems that alert drivers to unsafe conditions.
In Advanced Driver Assistance Systems, precise sensor data is essential for highly automated driving. It enables lane keeping and verifies vehicle movement information. Moreover, MEMS sensors with lower performance requirements are also increasingly utilized for navigation and telematics features.
MEMS sensors transmit chassis dynamics data to active suspension systems and enable greater comfort and driving safety. Low-pressure sensors in pneumatic seats monitor the pressure in the air chamber, which can then be adapted to the driver's individual anatomy and reduces driver fatigue on long journeys.
Barometric pressure sensors are vital for engine control units in ICE powertrain systems. They measure ambient pressure variations from altitude, weather, and temperature changes. This data helps to optimize engine performance, fuel efficiency, and enables accurate calculation of the air-fuel mixture.
In RNC systems, Bosch's MEMS acceleration sensors continuously detect vibrations caused by road noise close to the wheels. Based on this data, audio systems can effectively reduce interior noise with appropriate counter-frequencies.
Our sensors with a bandwidth of 10 kHz precisely detect the occurring vibrations in condition monitoring systems. The early detection of unusual frequencies enables predictive maintenance or performance optimization as well as the timely detection of system problems to avoid system downtimes.
SiC power devices
Bosch offers a comprehensive silicon carbide (SiC) power semiconductor portfolio for the mobility industry, including SiC power MOSFETs and SiC power modules designed for inverters, on-board chargers, and DC/DC converters. These solutions are available globally to OEMs, Tier1 suppliers, and distributors, both as bare dies and discrete components in various standard packaging formats. In addition, we offer OEMs and Tiers unrivalled flexibility as we tailor our SiC chips to their requirements regarding layout, electrical performance, and processing. Explore Bosch's SiC power semiconductor solutions and discover how our innovative technologies can enhance your high power applications.
Automotive ICs
Integrated circuits (ICs) are essential to vehicle control units. System ICs ensure actuator movements, information handling and safety relevant actions. They open up possibilities for customer-specific adaptations and are important levers for reducing manufacturing costs. Bosch develops and manufactures integrated circuits for safety-critical applications up to the highest ASIL (Automotive Safety Integrity Level) D.
IP Modules
IP (Intellectual property) modules represent an assembly plan to implement complete function blocks in hardware. Typical applications include, e.g. electric control units for engine, transmission and safety systems. Bosch is one of the pioneers in automotive IP business. IP modules allow chipmakers to quickly adopt complete ranges of functions in standard products such as microcontrollers, FPGAs and automotive ASSPs, thus significantly reducing development times and costs. We constantly develop IP modules and transfer functional updates to standards. Numerous suppliers and OEMs appreciate this system expertise and rely on processors with built-in Bosch IP modules for their electronic control units.
Featured Content
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SiC technology roadmap: the journey continues
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Innovating worldwide – Bosch semiconductor waferfabs and test centers
White Paper
Unlock silicon carbide insights: Explore the Bosch SiC white paper
Webinar
The SiC MOSFET road to excellence
Part 1: Bosch as a global SiC player
Part 2: SiC technology and innovations
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Automotive semiconductors – a history of success
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SMI330: ultra-low power, maximum versatility
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New SMP290 MEMS sensor with BLE: the efficient team player
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