The KIOXIA e-MMC series combines state-of-the-art BiCS FLASHTM TLC 3D flash memory technology with an integrated controller and multi-chip architecture (MCP), enabling high data density with low power consumption. The modules are housed in a compact 153-ball BGA package (11.5 mm × 13 mm, 0.8 mm high) and offer full compatibility with existing host systems via the standardized MMC Version 5.1 interface (1-, 4- or 8-bit I / O).
With a read speed of 340 MB / s and a write speed of 230 MB / s in HS400 mode, the e-MMCs deliver significantly improved performance compared to the fourth generation – with stable operating characteristics even under load and at high temperatures.
Benefits at a glance:
- BiCS FLASHTM generation 5 TLC 3D flash memory
- JEDEC e-MMC 5.1 standard for broad compatibility
- High performance: up to 340 MB/s read / 230 MB/s write
- Extended temperature range (-25 °C to +85 °C)
- Integrated controller with ECC and wear levelling
- Low energy consumption thanks to 1.8 V I / O voltage
- Stable performance during continuous operation and temperature changes
- Long-term availability and quality manufacturing from KIOXIA
Application examples:
- Industrial automation and control systems
- HMI and edge devices
- Smart home and IoT applications
- Digital cameras, wearables and portable devices
For more information to the e-MMC series by KIOXIA and a direct ordering option, please visit our e-commerce platform at www.rutronik24.com. |
Contact Rutronik:
| Chen Grace Wang | Corporate Product Manager Digital | +49 721 160258 36 | chen.wang@rutronik.com |