About Infineon Technology
Rutronik and Infineon Extend Partnership to Include Product Portfolio of Former Cypress
Following the acquisition of Cypress by Infineon, Infineon and Rutronik have expanded their partnership to include the additional product portfolio. With effect from October 01, 2020, Rutronik Elektronische Bauelemente GmbH is also a franchise distributor for the product portfolio of former Cypress.
The franchise covers the EMEA region and includes the complete product range.
"We are delighted with the expansion of our distribution network. This will further enhance our ability to support our customers with their system requirements in the future," explains Mathias Roettjes, Distribution & EMS Management EMEA at Infineon Technologies AG. In particular, the acquired Memory, Microcontroller, Sensing Technologies as well as the Wireless Portfolio represent an ideal addition to Rutronik's existing product range. These products will primarily cover Rutronik's target markets in the automotive, industrial, home appliance, motor control, and lighting industries. "As one of the leading distributors for active, passive, wireless and electromechanical components, we are delighted that we can now offer our customers an even wider portfolio. As a result, they can source all the products they need for their solutions from a single source at Rutronik," says Thomas Ulinski, Marketing Director Semiconductors Rutronik.
About Infineon Technologies
Infineon Technologies combines entrepreneurial success with responsible action to make life easier, safer and greener. Barely visible, semiconductors have become an indispensable part of everyday life. Ranked one of the global top 10 semiconductor companies, Infineon plays a key role in shaping a better future - with microelectronics that link the real and the digital world. Infineon´s semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world.
Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analogue, and mixed-signal applications.
Featured Products and Applications
Energy Efficiency
- Power generation from renewable energy sources: IGBT modules, SiC modules, discrete power devices
- Energy transmission and distribution: High-power IGBT modules
- Energy storage: IGBT modules, SiC modules
- Energy usage: Discrete power devices, IGBT modules, driver ICs, MCUs, SiC modules, SiC MOSFETs, SiC diodes, GaN HEMTs
Mobility
- Electro-mobility: IGBT modules, SiC modules, discrete power devices, MCUs, sensors
- Charging infrastructure for electro mobility: IGBT modules, SiC modules, SiC discretes, discrete power devices, MCUs, security solutions
- Automated driving: Sensors, radar, MCUs, power devices, memories, connectivity and security solutions
- Passenger and freight transport: High-power IGBT modules
- Infotainment: MCUs, touch control, Wi-Fi/BT controllers, USB Type-C PD controllers
Security
- Mobile devices: Security solutions based on contactless and dual-interface security controllers
- Authentication for the IoT: Embedded security solutions
- Industrial application: Embedded security solutions, TPMs, connectivity solutions
- Connected vehicles: Embedded SIMs, connectivity solutions
- Integrity of devices: TPMs
IoT and Big Data
- Smart cars: Sensors, radar, MCUs, power devices, memories, connectivity solutions, security solutions
- Smart home and smart building: Sensors, MCUs, power devices, memories, connectivity solutions, security solutions
- Smart things: Sensors, MCUs, power devices, memories, connectivity solutions, security solutions
- Smart factory: Sensors, MCUs, power devices, memories, connectivity solutions, security solutions
- Data and communication infrastructure: Power devices, memories, SiC devices, GaN HEMTs, RF devices
New Products Introduction
BGT60LTR11AIP -completely autonomous radar sensor
The BGT60LTR11AIP MMIC is a fully integrated microwave motion sensor including Antennas in Package (AIP) as well as built-in motion and direc-tion of motion detectors. A state machine enables operation of the device autonomously, i.e., without an external microcontroller or further signal processing. The detection threshold or sensitivity has 16 different levels in order to fulfill a configurable detection range from 0.5 m up to 7 m with a typical human target Radar Cross Section (RCS).The device can achieve power consumption of less than 2mW with ad-justable duty cycling.
XENSIV™ –IM67D130A high performance MEMS microphone for automotive applications
XENSIV™ -IM67D130A high performance MEMS microphone for automotive applicationsOur high-performance digital MEMS microphones are suited to all applications inside and outside the car, where the best audio per-formance in harsh automotive environments is required. These automotive microphones enable distortion-free audio capturing for all speech-related applications improving speech intelligibility for voice recognition algorithms. In addition, they perfectly support acoustic noise cancellation with its flat frequency and stable phase response. Other highlights include close sensitivity and phase matching, making automotive XENSIV™ MEMS microphones ideal for beamforming arrays.We offer two derivatives:IM67D130A high performance digital MEMS microphone IM67D120A high performance digital MEMS microphone for 16-bit codecs
EasyPACK™ Automotive IGBT 750V Half Bridge -FF300R08W2P2_B11A
The EasyPACK™ 2B is a very compact and flexible halfbridge solu-tion, optimized for inverter applicationsof hybrid and electric vehi-cles up to 230Arms. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A.The chipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harsh environmen-tal conditions. The EDT2 IGBTs also show excellent light load pow-er losses, which helps to improve system efficiency over a real driving cycle. The EasyPACK™ package is fully qualified for auto-motive applications and is validated according to AQG 324. Its high power cycling capability as well as the high creepage and clearance distances add to the product reliability. The power module comes with PressFIT Pins for the signal terminals to avoid additional time consuming selective solder processes, which provides cost sav-ings on system level and increases system reliability.
32-bit TriCore™ AURIX™ TC3Ex family
32-bit TriCore™ AURIX™ TC3Ex familyInfineon releases its AURIX™ TC3Ex microcontroller family. It comes back with an increase in performance, memory sizes, con-nectivity and more scalability to address the new automotive trends and challenges. In terms of performance, T3Ex offers 4 cores running at 300 MHz and up to 1.5 MBytes embedded RAM, and consuming below 2 W. Its mirrored embedded flash banks offers A/B swap capabilities.
BGSX44MU18 -4P4T MIPI antenna cross switch
BGSX44MU18 -4P4T MIPI antenna cross switch The BGSX44MU18 RF CMOS switch is specifically designed for LTE and 5G FR1 four-antenna applications.This 4P4T cross-switch offerslow insertion loss and low harmonic generation.The switch is controlled via aMIPI RFFE control interface. The on-chip controller allows power-supply voltages from 1.65 to1.95 V. The switch features direct-connect-to-battery functionality and DC-free RF ports.Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. The de-vice has a very small size ofonly 2.0 mm x 2.4 mm and a thickness of 0.63 mm.
PSoC™ 62S4 Pioneer Kit (CY8CKIT-062S4)
The PSoC 62S4 Pioneer Kit features the PSoC 62 MCU CY8C62x4 (CY8C6244LQI-S4D92) with: 150-MHz Arm® Cortex®-M4 and 100-MHz Arm Cortex-M0+ cores, 256KB of Flash, 128KB of SRAM, programmable analog blocks including two 12-bit SAR ADCs, pro-grammable digital blocks, Full-Speed USB, a serial memory inter-face, a CAN-FD interface, and industry-leading capacitive-sensing with CapSense™.
NPI Download
2022
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