Apacer's SLC-liteX Industrial SSDs
100,000 P/E Cycles Reached: Apacer's 3D NAND SSDs Deliver the Highest Endurance Available
Apacer has taken 3D NAND Flash optimization to new heights. Today, it announces the release of SLC-liteX industrial SSDs that can provide an incredible 100,000 P/E cycles. That's 3 to 33 times higher than competing 2D MLC or 3D TLC products can offer. 5G and AIoT manufacturers who are invested in large-scale data collection and analysis, including those demanding higher capacities, higher performance and higher endurance, will quickly see the advantages of this development. According to Allied Market Research, "the global 3D NAND flash memory market size was valued at $12.38 billion in 2020, and is projected to reach $78.42 billion by 2030, registering a CAGR of 20.3% from 2021 to 2030."
The endurance of any NAND Flash product can be measured in P/E cycles. Every time a write or erase action is performed, the Flash cell will suffer irreparable damage. In the industrial world, 3,000 P/E cycles was considered quite a competitive number. But with increasing demands for greater endurance thresholds in applications such as 5G O-RAN and edge computing switches, the market was hungry for more – while still recognizing the paramount importance of cost-effectiveness. Apacer's crack team of firmware experts tackled the problem and were able to tweak the technology to deliver 100,000 P/E cycles. Careful cell distribution management of the 3D TLC structure was necessary in order to correctly adjust the voltage delta and charge sensing. Furthermore, powered by carefully selected industrial grade NAND components, the firmware structure is specifically optimized to enhance NAND flash stability during daily operations, and the error handling algorithm is significantly improved to avoid any unexpected ECC errors.
An innovation like this also benefits from Apacer's long-term cooperation with some of the world's top component and material suppliers, and long-term stable component supply is assured. In fact, Apacer's SATA SH250, SATA SH24D, and PCIe PH920 series are currently available with 100,000 P/E cycles in a variety of specifications. Gaming, surveillance, edge computing and 5G smart IoT operations will all benefit from the increase in endurance. For manufacturers building products that are planned for use in challenging environments, these products are also available with established value-adding features such as wide-temperature operation, which allows devices to function smoothly even in temperatures as low as -40 or as high as 85 degrees Celsius. This is just another way Apacer is demonstrating its core value of "Becoming Better Partners."
Applications
- NVR
- IPC
- Gaming
- Networking
Value-Added Technologies
- SSDWidget 2.0
- TCG-Opal 2.0
- Signed Firmware
- Page Mapping
- Anti-Sulfuration
- Wide Temperature
Product Features
SH250-M242
Interface: SATA 3.2 (6Gb/s)
Connector: M.2 B & M key
Form Factor: M.2 2242-D5-B-M
Capacity: 10GB~160GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms (compliant with MIL-STD-202G) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 430 mA / Idle mode: 65 mA |
|
Dimension (L x W x H ) |
42.00 mm x 22.00 mm x 3.80 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-7LP2 180D
Interface: SATA 3.2 (6Gb/s)
Connector: 7-pin
Form Factor: SATA Disk Module
Capacity: 20GB ~ 80GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
72K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
Optional |
|
H/W Write Protect |
Optional |
|
Screw Hole |
No |
|
Cable-less Solution |
Optional (7+2 cable-less, Pin 7 Power cable-less) |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms (compliant with MIL-STD-202G) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
5V ± 5% |
|
Power Consumption |
Active mode: 325 mA / Idle mode: 55 mA |
|
Dimension (L x W x H ) |
Active mode: 3233.00 x 29.30 x 8.85 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-M280
Interface: SATA 3.2 (6Gb/s)
Connector: M.2 B & M key
Form Factor: M.2 2280-D5-B-M
Capacity: 10GB~320GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15~2000 Hz/sine (compliant with MIL-STD-810G)" |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 450 mA / Idle mode: 65 mA |
|
Dimension (L x W x H ) |
Single side: 80.00 mm x 22.00 mm x 2.38 mm Double side: 80.00 mm x 22.00 mm x 3.88 mm" |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-300
Interface: SATA 3.2 (6Gb/s)
Connector: 52-pin mSATA connector
Form Factor: JEDEC MO-300
Capacity: 10GB~160GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 420 mA / Idle mode: 65 mA |
|
Dimension (L x W x H ) |
50.80 x 29.85 x 4.85 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-25
Interface: SATA 3.2 (6Gb/s)
Connector: (7+15) pin
Form Factor: 2.5"
Capacity: 10GB~320GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms (compliant with MIL-STD-202G) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
5.0 V±5% |
|
Power Consumption |
Active mode: 385 mA / Idle mode: 50 mA |
|
Dimension (L x W x H ) |
7mm:100.00 x 69.85 x 6.90mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-300B
Interface: SATA 3.2 (6Gb/s)
Connector: 52-pin mSATA connector
Form Factor: mSATA mini, JEDEC MO-300B
Capacity: 10GB~80GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 500 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G/11ms Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 420 mA / Idle mode: 65 mA |
|
Dimension (L x W x H ) |
29.85 x 26.80 x 3.85 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH24D-25
Interface: SATA 3.2 (6Gb/s)
Connector: (7+15) pin
Form Factor: 2.5"
Capacity: 160GB~640GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
Yes |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 490 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
85K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-55 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
- |
|
Shock |
MIL-STD-202G, Condition A MIL-STD-883K, Condition B |
|
Vibration |
MIL-STD-810G, Method 514.6, Procedure I, Category 24 MIL-STD-810G, Method 514.6, Procedure I, Category 7 |
|
Operating Voltage |
5V ± 10% |
|
Power Consumption |
Active mode: 435 mA / Idle mode: 60 mA |
|
Dimension (L x W x H ) |
100.00 x 69.84 x 9.30 (mm) |
|
MTBF (hours) |
>5,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH24D-M280
Interface: SATA 3.2 (6Gb/s)
Connector: M.2 B & M key
Form Factor: M.2 2280-D5-B-M
Capacity: 160GB~640GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
Yes |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 490 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
85K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-55 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
- |
|
Shock |
MIL-STD-202G, Condition A MIL-STD-883K, Condition B |
|
Vibration |
MIL-STD-810G, Method 514.6, Procedure I, Category 24 MIL-STD-810G, Method 514.6, Procedure I, Category 7 |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 625 mA / Idle mode: 85 mA |
|
Dimension (L x W x H ) |
80.00 x 22.00 x 3.88 (mm) |
|
MTBF (hours) |
>5,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH24D-300
Interface: SATA 3.2 (6Gb/s)
Connector: 52-pin
Form Factor: JEDEC MO-300
Capacity: 160GB~640GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
Yes |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 490 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
85K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-55 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
- |
|
Shock |
MIL-STD-202G, Condition A MIL-STD-883K, Condition B |
|
Vibration |
MIL-STD-810G, Method 514.6, Procedure I, Category 24 MIL-STD-810G, Method 514.6, Procedure I, Category 7 |
|
Operating Voltage |
3.3 V ± 5% |
|
Power Consumption |
Active mode: 625 mA / Idle mode: 85 mA |
|
Dimension (L x W x H ) |
50.80 x 29.85 x 4.85 (mm) |
|
MTBF (hours) |
>5,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
SH250-CFast
Interface: SATA 3.2 (6Gb/s)
Connector: (7+17) pin male
Form Factor: CFast
Capacity: 10GB ~ 160GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 560 |
|
Sequential Write Performance (MB/sec) |
Up to 510 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
70K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
Yes |
|
H/W Write Protect |
No |
|
Screw Hole |
No |
|
Cable-less Solution |
No |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: 50G, 11ms Non-operation: 1500G, 0.5ms |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3 V±5% |
|
Power Consumption |
Active mode: 420 mA / Idle mode: 75 mA |
|
Dimension (L x W x H ) |
42.80 x 36.45 x 3.60 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
PH920-M280
Interface: PCIe Gen3 x4
Connector: M.2 M Key
Form Factor:
- M.2 2280 single side, M Key: 160GB
- M.2 2280 double side, M Key: 320GB
- 640GB
Capacity:
- Single side: 160GB
- Double side: 320GB~640GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
- |
|
Sequential Read Performance (MB/sec) |
Up to 1740 |
|
Sequential Write Performance (MB/sec) |
Up to 1530 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
265K |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
Yes |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
Yes |
|
Shock |
Operation: Acceleration, 50(G)/11(ms)/half sine (compliant with MIL-STD-202G) Non-operation: Acceleration,1,500(G)/0.5 (ms)/half sine (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation:4.02 Grms, 15~2000 Hz/random (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3V ±5% |
|
Power Consumption |
Active mode: 1100 mA / Idle mode: 260 mA |
|
Dimension (L x W x H ) |
Single side: 22.00 x 80.00 x 2.58 (max) (mm) Double side: 22.00 x 80.00 x 4.08 (max) (mm) |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 100K; MLC-liteX upon request. |
UH110-UFM1
Interface: USB 2.0
Connector: 10-pin (2x5) female header in 2.54mm
Form Factor: USB Disk Module
Capacity: 8GB~32GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 41 |
|
Sequential Write Performance (MB/sec) |
Up to 25 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
500 |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 |
|
Storage Temperature ( °C ) |
-40 ~ 100 |
|
Housing |
No |
|
H/W Write Protect |
No |
|
Screw Hole |
Yes |
|
Cable-less Solution |
No |
|
Thermal Sensor |
No |
|
Shock |
Operation: 50G/11ms (compliant with MIL-STD-202G) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15~2000 Hz/random (compliant with MIL-STD-810G) |
|
Operating Voltage |
5.0 V ± 5% |
|
Power Consumption |
Active mode: 95 mA; Idle mode: 70 mA |
|
Dimension (L x W x H ) |
36.9 x 26.6 x 9.7 (mm) |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 30K; MLC-liteX upon request. |
UH110-UFD1
Interface: USB 3.2 Gen1
Connector: USB Type A Plug
Form Factor: USB flash drive
Capacity: 16GB~64GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 270 |
|
Sequential Write Performance (MB/sec) |
Up to 140 |
|
ECC Engine |
Low-Density Parity-Check (LDPC) Code |
|
IOPS (4K Random Write) |
900 |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ + 85 *Not supported on 16GB |
|
Storage Temperature ( °C ) |
-55 ~ + 100 |
|
Housing |
Yes |
|
H/W Write Protect |
No |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
- |
|
Shock |
Operation: 50G/11ms (compliant with MIL-STD-202G) Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15~2000 Hz/random (compliant with MIL-STD-810G) |
|
Operating Voltage |
5.0 V ± 5% |
|
Power Consumption |
Active mode: 200 mA; Idle mode: 85 mA |
|
Dimension (L x W x H ) |
46.85 mm x 17.2 mm x 7.7 mm |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 30K; MLC-liteX upon request. |
CH210-MSD
Interface: SD5.0
Connector: -
Form Factor: Micro SD
Capacity: SDHC:16GB~64GB
|
Operation Mode |
- |
|
Transfer Mode |
- |
|
NAND Flash Type |
3D TLC |
|
External DRAM |
- |
|
Sequential Read Performance (MB/sec) |
Up to 90 |
|
Sequential Write Performance (MB/sec) |
Up to 70 |
|
ECC Engine |
Built-in advanced ECC algorithm |
|
IOPS (4K Random Write) |
300 |
|
Standard Operating Temperature ( °C ) |
-25 ~ + 85 |
|
Extended Operating Temperature ( °C ) |
- |
|
Storage Temperature ( °C ) |
-40 ~ + 100 |
|
Housing |
- |
|
H/W Write Protect |
- |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
- |
|
Shock |
Operation: Acceleration, 50(G)/11(ms)/half sine (compliant with MIL-STD-202G) Non-operation: Acceleration,1,500(G)/ 0.5(ms)/half sine (compliant with MIL-STD-883K) |
|
Vibration |
Operation:7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation:4.02 Grms, 15~2000 Hz/random (compliant with MIL-STD-810G) |
|
Operating Voltage |
2.7V ~ 3.6V |
|
Power Consumption |
Active mode: 80 mA & Idle mode: 135 uA |
|
Dimension (L x W x H ) |
15x11x1 (mm) |
|
MTBF (hours) |
>3,000,000 |
|
P/E Cycles |
SLC-liteX up to 30K; MLC-liteX upon request. |
CH710-CF
Interface: PC Card Memory Mode; PC Card I/O Mode; True IDE Mode
Connector: 50-pin
Form Factor: CompactFlash Type I
Capacity: 8GB ~ 64GB
|
Operation Mode |
- |
|
Transfer Mode |
PIO Mode 6, Multiword DMA Mode 4, Ultra DMA Mode 6 |
|
NAND Flash Type |
3D TLC (BiCS3) |
|
External DRAM |
No |
|
Sequential Read Performance (MB/sec) |
Up to 115 |
|
Sequential Write Performance (MB/sec) |
Up to 80 |
|
ECC Engine |
Built-in BCH ECC capable of correcting up to 96 bits in 1KB data |
|
IOPS (4K Random Write) |
Up to 2100 |
|
Standard Operating Temperature ( °C ) |
0 ~ + 70 |
|
Extended Operating Temperature ( °C ) |
-40 ~ +85 |
|
Storage Temperature ( °C ) |
-40 ~ +100 |
|
Housing |
- |
|
H/W Write Protect |
No |
|
Screw Hole |
- |
|
Cable-less Solution |
- |
|
Thermal Sensor |
No |
|
Shock |
Operation: 50G, 11ms Non-operation: 1500G, 0.5ms |
|
Vibration |
Operation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15~2000 Hz/sine (compliant with MIL-STD-810G) |
|
Operating Voltage |
3.3 V / 5.0 V ± 5% |
|
Power Consumption |
Operating Voltage: 3.3V – Active mode: 185 mA – Standby mode: 10 mA Operating Voltage: 5.0V – Active mode: 190 mA – Standby mode: 10 mA |
|
Dimension (L x W x H ) |
36.4 x 42.8 x 3.3 mm |
|
MTBF (hours) |
>1,000,000 |
|
P/E Cycles |
SLC-liteX up to 30K; MLC-liteX upon request. |
Comparison Table
Introduction
NAND Flash is now a mature technology. Many formats are already adopted by many industrial applications. However, with a desire to push the envelope, Apacer has developed certain optimizations of NAND Flash technology. The goal of these optimizations is to provide customers with the amount of P/E cycles that best suits their application.
SLC-lite : The Balanced Solution
SLC-lite is an existing form of NAND Flash Optimization. The central concept behind Apacer SLC-lite is to make MLC behave like SLC. To achieve this, only half the bits of MLC are programmed. By programming only the stronger bit, the cell distribution behaves almost identically to that of SLC flash. This improves the precision of delta and the theshold voltage of each cell. The endurance of the resulting device, as measured in P/E cycles, will be higher.
MLC-liteX
Apacer's engineers developed a similar process to SLC-lite for 3D NAND drives. The two new forms of this technology are called SLC-liteX and MLC-liteX is based on 3D NAND technology. The firmware is fine-tuned in such a way as to offer more than three times as many P/E cycles (10,0000) than MLC or industrial 3D TLC. Cost-benefit optimization is archieved while lifespans are still extended.
SLC-liteX
SLC-liteX is also based on 3D NAND technology, and the central concept is to make 3D TLC behave like SLC. To do this, cell distribution management for 3D TLC is necessary in order to greatly adjust the voltage delta and charge sensing. The firmware is carefully tweaked by Apacer's engineering team to offer the greatest number of P/E cycles in this format - 100,000, which is over 33 times more than MLC or industrial 3D TLC.
How SLC-liteX Reaches 100,000 P/E Cycles
In Order to maximize SSD endurance, Apacer has enhanced its SLC-liteS technology to achieve 100K P/E cycles. Powered by carefully selected NAND componentsm the firmware structure is specifially optimized to enchance NAND flash stability during daily operations, and the error handling algorithm is significantly improved to avoid any unexpected ECC errors. The result is a prolonged SSD lifespan.
Comparison of Optimization Formats
The real benefit of these optimizations is flexibility. Depending on their needs, buyers can select the numbner of P/E cycles that they require. 3D NAND Flash optimization allows Apacer to deliver better value for cost-effectivess, and for our customers to produce devices that will funtion smoothly until they reach the end of their operational lifetimes.
Advantages of Using MLC-liteX and SLC-liteX
Apacer SLC-liteX and MLC-liteX products are based on 3D NAND architectur, but their reliability is improved by customized firmware.
Benefits
- Increased endurance up to 100,000 P/E cycles
- Cost saving more than 86% compared to SLC
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