Apacer innovates again by announcing mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules by using Samsung's original wide-temperature grade chips to support cutting-edge platforms including AMD's Ryzen™ Embedded V2000 processor and Intel's Tiger Lake and Elkhart Lake. Apacer drew on over 20 years of experience to create a full range of DDR4-3200 modules in the UDIMM, SODIMM, ECC UDIMM, ECC SODIMM, and RDIMM form factors. 8GB, 16GB and 32GB capacities are all available. Value-adding features such as anti-sulfuration, conformal coating and underfill can all be added to protect them from corrosion, moisture, vibration, dust and thermal shock. From end to edge to cloud, Apacer's full range of wide-temperature memory modules will significantly improve the stability and reliability of systems for long-term operation in harsh environments.
