Apacer innovates again by announcing mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules by using Samsung's original wide-temperature grade chips to support cutting-edge platforms including AMD's Ryzen™ Embedded V2000 processor and Intel's Tiger Lake and Elkhart Lake.
Apacer drew on over 20 years of experience to create a full range of DDR4-3200 modules in the UDIMM, SODIMM, ECC UDIMM, ECC SODIMM, and RDIMM form factors. 8GB, 16GB and 32GB capacities are all available. Value-adding features such as anti-sulfuration, conformal coating and underfill can all be added to protect them from corrosion, moisture, vibration, dust and thermal shock. From end to edge to cloud, Apacer's full range of wide-temperature memory modules will significantly improve the stability and reliability of systems for long-term operation in harsh environments.
Apacer is one of the few industrial memory manufacturers that insists on using original factory-specification wide-temperature ICs, and strictly selects top-quality materials (DRAM, PCB, Resistors, and Capacitors) to ensure products operate smoothly at temperatures as low as -40 degrees C or as high as +85 degrees C. By using industrial-grade wide-temperature-range passive parts with 30μ" gold plating PCB, it improves anti-oxidation and ensures stability of signal transmission. A full range of DDR4-3200 module have passed industrial verification testing for high/low temperatures and the most stringent 48-hour thermal cycling test, ensuring their ability to operate for long hours in extreme environments.
Applications: AIoT / Outdoor Embedded and Edge Devices / Networked Communication Systems / Telecommunication Systems / Cloud Equipment