The advantages of resonant designs over inductive ones clearly improve user-friendliness: devices may be freely placed in the vicinity of the transmitter (typically >50mm of vertical freedom), multiple devices of different size and power can be charged in parallel.
Thanks to the robust silicon MOSFET technology Infineon's products take the lead in fast switching. With the best figure-of-merit for gate charge times RDS(on) and for Coss they enable the customer to build 6.78MHz inverter designs. Superior power MOSFET technology addresses frequency switching implementations, especially in the 30V - 100V areas for class D inverter designs and in the 150V - 250V voltage class for class E inverter designs.
Rather than relying on an application specific IC for protocol and power delivery, the strength of the Infineon wireless charging solution lies in its modular software-based architecture. Infineon's XMC™ wireless power controller based on the ARM® Cortex®-M0 core provides a powerful and cost-effective platform for high performance, smart and safe wireless charging applications.
And on top of all that within Infineon's portfolio the "coolest" driver ICs in the industry are already available as low side drivers for class E implementations. And for transmitter designs using a pre-regulator (buck or buck/boost) to control the input voltage of the amplifier OptiMOS™ solutions can be found in the 20V-400V MOSFETs section.