High voltage solid-state power distribution

Infineon’s super solid-state solutions (S4) for smart power distribution

A century ago, the first electro-mechanical circuit breakers emerged. Today, the era calls for a transition to smart and intelligent solid-state devices. Unlike their conventional counterparts, solid-state solutions offer unparalleled control and protection capabilities. Historically, the adoption of solid-state technology was hindered by limited availability and high costs, limiting its use to niche applications. However, with Infineon's innovative power semiconductors, cost-effective and advanced solid-state solutions can now be implemented on a larger scale.

Smart solid-state circuit breakers integrate advanced functionality into one single device:

  • Combines protection, actuation, load control, diagnostic, metering and secure communication 
  • AC and DC agnostic
  • Offers secure web/IoT connectivity
  • Captures and logs data in real time
  • Enables smart power balancing and control of peak loads
  • Detects and isolates faults in sub µs range
     

Customer benefits

  • Provides noise-less and wear-free load switching with real-time control capability
  • Enables remote load control and diagnostic in real time
  • Optimized system performance thanks to highly accurate and user programmable tripping characteristics
  • Supports smart billing, even for sub-branches by accurately monitoring energy usage
  • Provides state-of-health diagnostics of connected loads
  • Easy to install and replace, since it matches current MCB’s form factor
  • Supports OCP, AFDD/AFCI and RCD/GFCI, all-in-one, for enhanced safety and protection for both AC and DC grids
  • Compliant with industrial certification standards and support ZVS and ZCS for smart and soft switching 
  • Smart power balancing and peak load control for optimal energy efficiency as it can be applied for AC and DC grids 
  • Secure web and I-o-T connectivity, along with state-of-health diagnostics of connected loads, makes solid-state circuit breakers a highly advanced and reliable solution for modern power systems

Infineon’s S4 system solution offering: From sensing, control, and communication to the next level of connectivity and security


Power distribution goes smart. Solutions for super solid-state circuit breakers
Solid-state circuit breaker reference design user guide
Power and sensing selection guide

As we shift towards renewable energy, digitalizing the power distribution system becomes crucial. Join this webinar to uncover the capabilities of smart circuit breakers in protection, measurement, programmability, communication, and actuation, essential for a sustainable and smart energy landscape.

This user guide describes the setup and evaluation of the solid-state circuit breaker (SSCB) reference design: REF_SSCB_AC_DC_1PH_16A. It provides a brief overview of the SSCB reference design concept, functions, and protection and diagnosis implementations.

1. Power stage

Choose from our scalable offering including CoolMOS™ SJ MOSFETs and CoolSiC™ MOSFETs as discrete devices or in module packages, meeting individual system requirements regarding the power to be interrupted, the tripping characteristics, and the embedding of motor starter solutions.

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The S7 family of high-voltage superjunction MOSFETs sets a new benchmark for power density, by uniquely fitting a 17 mΩ chip into an innovative small QDPAK SMD package, which comes in both top-side and bottom-side variants. It is an ideal fit for applications where MOSFETs are switched at low frequency, such as active-bridge rectification, inverter stages, in-rush relays, PLCs, power-solid-state relays, and solid-state circuit breakers.

Features

  • Best-in-class RDS(on) in SMD package
  • Optimized for conduction performance
  • Granular portfolio in RDS(on) range from 10 mΩ - 65 mΩ
  • High pulse current capability
 

 

Benefits

  • Increased energy efficiency
  • More compact and easier designs
  • Eliminate/reduce heat sink in solid-state design
  • Lower TCO cost or BOM cost

 

QDPAK TSC
IPDQ60R010S7
10mΩ

QDPAK BSC
IPQC60R010S7
10mΩ

TOLL
IPT60R022S7
22mΩ

The CoolMOS™ S7T SJ MOSFET embeds a temperature sensor which is 40% more accurate and 10x faster compared to discrete sensor solutions and is optimized for low-frequency and high-current switching applications such as solid-state relay, circuit breaker, motor starters and line rectification designs in SMPS.

Features

  • CoolMOS™ S7 technology
  • Temperature sense feature for protection
    and optimized thermal device utilization cost
  • Seamless diagnostics at lowest system cost
     

 

Benefits

  • Increased system performance
  • Allow more compact design over EMR
  • Lower BOM or/and TCO over prolonged time
  • Optimized price-performance in low-frequency switching applications

 

TOLL
IPT60T022S7
22mΩ

TOLL
IPT60T040S7
40mΩ

TOLL
IPT60T065S7
65mΩ

Infineon CoolSiC™ MOSFETs are built on a state-of-the-art trench semiconductor process optimized to allow for both the lowest losses in the application and the highest reliability in operation. The broad 750V and 1200V CoolSiC™ MOSFET discrete portfolio enables a flexible parameter-set for implementation of application-specific features.

Features

  • Highly robust 750 V technology
  • Best-in-class RDS(on) in SMD
  • 100% avalanche tested
  • Integrated Kelvin source
 

 

Benefits

  • Enhanced robustness to withstand bus voltages beyond 500 V
  • Superior efficiency
  • Robustness against parasitic turn on
  • Best-in-class thermal dissipation

 

QDPAK TSC
IMDQ75R008M1H
8 mΩ

QDPAK TSC
IMDQ75R016M1H
16 mΩ


QDPAK TSC
IMDQ75R040M1H
40 mΩ

The CoolSiC™ MOSFET  Discrete 1200 V is build on a state-of-the-art trench semiconductor process optimized to combine performance with reliability in operation. The low power losses of CoolSiC™ technology, combined with .XT interconnection technology in a new 1200 V optimized SMD package, enables top efficiency and passive cooling potential in applications such as drives, chargers and industrial powers supplies.

 

Features

  • Very low switching losses
  • Short-circuit withstand time, 3 µs
  • Fully controllable dV/dt
  • Benchmark gate threshold voltage of 4.5 V
  • Robustness against parasitic turn-on
  • Robust body diode for hard commutation
  • Package creepage & clearance distances >6.1mm
  • Sense pin for optimized switching performance

     

Benefits

  • Efficiency and power density improvement
  • Cooling effort reduction
  • Reduction of system complexity and cost
  • SMD package enables direct integration into PCB,
    with natural convection cooling without extra heatsink

 

D2PAK-7L
IMBG120R008M2H
8 mΩ


IMW120R007M1H
7 mΩ


IMZA120R007M1H
7 mΩ

2. Control and Isolation

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Every switch needs a driver – the right driver makes a difference. Power electronics applications employ power device switches. And power device switches require optimum gate drive solutions. That’s why we offer more than 500 EiceDRIVER™ gate driver IC solutions suitable for any power switch, and any application.

The ISOFACE™ dual- and quad-channel digital isolators are based on Infineon’s coreless transformer (CT) technology and provide robust high-voltage isolation for a broad range of applications. They are the preferred choice for isolated gate signal transfer in high-density power designs and isolated communication, such as in a UART voltage level shifter or CAN BUS isolation. Infineon's digital isolators are pin-to-pin compatible with competitors’ portfolio and offer improved CMTI performance and a lower current consumption with high propagation delay accuracy.

2DIB1400F


4DIR2401H

3. Microcontrollers

For remote control, diagnostics, monitoring and predictive maintenance purposes, discover Infineon’s 32-bit XMC™ and PSoC™ microcontroller family with advanced AI and Machine Learning capabilities.

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The XMC1300 32-bit microcontroller brings together the ARM® Cortex®-M0 core and differentiating peripherals, with a focus on low-cost embedded control applications. XMC1000 addresses a broad application spectrum from typical 32-bit applications up to digital power conversion and even field-oriented motor control. XMC1300 family can integrate all the control and analog interface functions required for sensor less Field Oriented Control (FOC), brushless (BLDC), brushed DC and PMSM motors.

XMC1000 is the most cost-effective, entry level MCU family to address the protection and control needs of solid-state solutions.

KIT_XMC13_BOOT_001

XMC4500 combines Infineon's leading-edge peripheral set with an industry-standard ARM® Cortex®-M4 core resulting in a power pack for energy-efficient industrial applications. XMC4500 controllers feature a configurable peripheral set that allow to tailor the device to specific application needs.

All XMC4000 devices are powered by Arm® Cortex®-M4 with a built-in DSP instruction set. The Single Precision Floating Point Unit, Direct Memory Access (DMA) feature and Memory Protection Unit (MPU) are state-of-the-art for all devices – even the smallest XMC4000 runs with up to 80MHz in core and peripherals. It comes with a comprehensive set of common, fast and precise analog/mixed signal, Timer/PWM and communication peripherals.

XMC4000 family delivers higher performance, larger embedded memory (Flash/RAM) and multiple communication interfaces to address the needs of solid-state solutions.

XMC4502-F100K768 AC

KIT_XMC45_RELAX_LITE_V1

The PSoC™ 62 performance line, built on an ultra-low power 40-nm platform, is a combination of Arm® Cortex®-M4 and Arm® Cortex®-M0+ CPUs, with low-power Flash technology, programmable digital and analog resources, and best-in-class CAPSENSE™ technology for touch and proximity applications. Security is built into the platform architecture with hardware cryptographic accelerators, memory and peripheral protection units. PSoC™ 62 performance line is offered in a variety of packages including BGA, WLCSP, QFN, TQFP, and supports up to 2 MB of flash, 1 MB of on-chip SRAM, and up to 104 GPIOs.

PSoC™ 62 offers a secure, high-performance and flexible MCU with programmable digital and analog resources, large memory footprint and multiple package options to address the varied needs of solid-state solutions.

ModusToolbox™ Software

Infineon's ModusToolbox™ is a collection of easy-to-use software and tools that enable rapid development of Infineon microcontrollers and AIROC™ Wi-Fi and Bluetooth® devices. It provides both development tools and run-time software for a flexible and comprehensive development experience. 
The ModusToolbox™ tools package includes desktop programs that enable the creation of new embedded applications, managing software components, configuring device peripherals and middleware, and embedded development tools for compiling, programming, and debugging. The ModusToolbox™ run-time software includes an extensive collection of GitHub-hosted repositories comprised of code examples, board support packages, middleware, and application support.

4. Connectivity

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The AIROC™ CYW20835 is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions.
Infineon's AIROC™ CYW20835 Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20835 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBLE-343072-02 module is supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications. AIROC™ CYW20835 SoC and modules offer a reliable, low-power IoT connectivity solution for Solid-State Circuit Breakers used in smart home integration, local monitoring and control with smartphone, based on the latest Bluetooth® 5.4 core spec.

CYW20835PB1KML1GGF SoC

The Infineon AIROC™ CYBLE-343072-EVAL-M2B Bluetooth® LE Module Evaluation Kit enables evaluation, prototyping, and development of a wide array of IoT applications based on the AIROC™ CYBLE-343072-02 globally-certified module. AIROC™ CYBLE-343072-02 is a 2.4GHz Bluetooth Transceiver Module with an Integrated Trace antenna and is based on the AIROC™ CYW20835 system on a chip (SoC), an ultra-low-power Bluetooth® LE 5.2 device.

CYBLE-343072-02 module


CYBLE-343072-EVAL-M2B

Infineon’s AIROC™ CYW43012 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.0. With a low-power architecture, the CYW43012 is ideal for battery powered applications where best-in-class power consumption is critical. The CYW43012 provides 802.11ac friendliness by supporting 256-QAM (for 20 MHz channels in the 5 GHz band) enabling data rates up to 78 Mbps with 802.11ac access points. On-chip power amplifier and low-noise amplifiers are included for both the 2.4 and 5GHz bands.
The CYW43012 can deliver both local control via smartphone and cloud-based control in the industry’s lowest-power Wi-Fi 4/Bluetooth® 5.0 combo solution.

AIROC™ CYW43012
 

Murata LBEE59B1LV-278
Recommended partner module

5. Security

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The OPTIGA™ Trust M is a high-end security solution that provides an anchor of trust for connecting IoT devices to the cloud, giving every IoT device its own unique identity. This pre-personalized turnkey solution offers secured, zero-touch onboarding and the high performance needed for quick cloud access.
The turnkey set-up with full system integration minimizes design, integration and deployment effort.

OPTIGA™ Trust M is available in two temperature ranges:

  • SLS32AIA010MK standard temperature range of -25 to +85°C for most commercial implementations
  • SLS32AIA010ML extended temperature range of -40 to +105°C for harsh industrial environments

SLS32AIA010ML


The OPTIGA™ Trust M IoT Security Development Kit is the easiest way to develop and evaluate end-to-end security use cases for your IoT devices. The kit enables you to prototype various security use cases and build full-featured IoT applications. 
The board includes:

  • OPTIGA™ Trust M security solution
  • PSoC™ 62, an Arm® Cortex®-M4/M0+ microcontroller
  • AIROC™ CYW43012 Wi-Fi & Bluetooth® combo chip is a low power device that supports dual-band (2.4 and 5.0 GHz) Wi-Fi and Bluetooth® 5.0.

OPTIGA™ Trust M IoT Kit

6. Sensing

Infineon's XENSIV™ current sensors are capable of measuring both AC and/or DC currents with high accuracy and stability, reaching up to 120 A or 31 mT, respectively. The XENSIV™ family of high-precision coreless open-loop current sensors are compact, cost-effective, and leverage Infineon’s precise and stable Hall effect current sensor IC technology.
 

TLE4971-A120T5

7. Power supply

Our power supply offering for solid state solutions includes the CoolSET™ AC-DC integrated power stages for additional protection and system robustness and low dropout (LDO) linear voltage regulators both easy-to-use integrated circuits (ICs) for efficient and reliable power supply.

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The CoolSET™ AC-DC integrated power stages, available in fixed frequency and quasi-resonant switching schemes are designed to provide increased reliability and exceptional performance while providing additional protection to enhance system robustness.

CoolSET package

Infineon’s OPTIREG™ family of linear voltage regulators (LDO) are easy-to-use integrated circuits (ICs) that provide simple power supply solutions. They are available in multiple variants including high precision tracking linear voltage regulators, variable linear voltage regulators, ultra-low quiescent current voltage regulators (LDO), and high-performance voltage regulators.

Voltage Regulators


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