Infineon targets the complete EV charging ecosystem from AC to high-power DC

The increasing demand for EV infrastructure has created a highly competitive market for EV charging systems, in which design engineers must differentiate their systems in terms of size, efficiency, and performance. Infineon meets this demand through their vast semiconductor portfolio for the whole system. With a broad range of both silicon and wide bandgap solutions for power, as well as solutions for control, connectivity, and security, designers can find the best-fit products for their system requirements all in one place. Practical reference designs and evaluation boards for various EV charging systems jumpstart the design-in phase, while Infineon’s extensive global support network, comprehensive training catalog, and detailed product documentation ensure customers can bring their designs to market faster.

Infineon offers all of the components needed to design advanced EV charging systems in one place – from power and sensing to connectivity and security.

Customer benefits:

  • Fast time-to-market and convenient design-in process
  • Save time and resources in design-in phase
  • Differentiate through advanced designs
  • Ability to offer quality, long-lasting, and reliable systems
  • Production security


Explore a carefully curated selection of products designed to optimize your EV charging systems:


EiceDRIVER™ Compact single-channel isolated gate driver

EiceDRIVER™ offer a wide portfolio of single and dual channel isolated gate driver for driving IGBT, Si and SiC MOSFETS in EV Charging power conversion designs. Whatever the design requires, the different versions comprising active Miller clamp or separate-output (Compact), DESAT, soft-off and active Miller Clamp (Enhanced) and variants with optional two-level slew-rate control offer.


Fast, robust, dual-channel, functional isolated MOSFET gate drivers with accurate and stable timing

CoolSiC™ MOSFET half-bridge module 1200 V

The CoolSiC™ silicon carbide MOSFET power modules are available in various configurations such as 3-level, half-bridge, four-pack, six-pack or as booster. The 1200 V and 2000 V SiC MOSFET modules offer superior gate-oxide reliability enabled by a state-of-the-art trench design and best-in-class switching and conduction losses. Integrated NTC temperature sensors and versions with low thermal resistance AlN substrate and pre-applied Thermal Interface Material (TIM) make them even more versatile.


CoolSiC™ MOSFET sixpack module 1200 V

CoolSiC™ 1200 V, 30 mΩ SiC Trench MOSFET in TO-247-4 package

The CoolSiC™ MOSFET discrete devices are ideal for hard- and resonant-switching topologies. They are manufactured in a state-of-the-art trench semiconductor process that is optimized to provide both the lowest losses in application and the highest reliability in operation. The CoolSiC™ discrete MOSFET portfolio is available in 650 V, 750 V, 1200 V, 1700 V and 2000 V voltage classes, with on-resistance ratings starting from 6.7 mΩ and various space-saving and high-performance packages to realize highly efficient and reliable DC EV charger designs.


1200 V Silicon Carbide Schottky diode in TO-247-2 package

The CoolSiC™ Schottky diode portfolio includes 600 V and 650 V to 1200 V Schottky diodes and is a first-class addition to the CoolSiC™ MOSFET portfolio.


IGBT Discrete

The Infineon IGBT product selection provides a broad variety of different devices and package options. They offer very low power losses in the forward and blocking state, require only low drive power and have a high efficiency.


The 600V CoolMOS™ P7 superjunction (SJ) MOSFET

IPW60R037P7XKSA1 is part of the 600 V / 650 V CoolMOS™ P7/C7/CFD7 family, a large portfolio with granular RDS(on) selection and different space-saving and high-performance packages to realize cost sensitive DC EV Charger designs.


The Infineon XENSIV™ TLI4971-A1205T5-E0001

The minimal insertion inductance and resistance, small package sizes combined with outstanding thermal performance, high peak current capability and galvanic isolation make XENSIV™ current sensors perfect for high voltage and high current applications like EV Charging.


11 kW SiC bi-directional DC/DC converter board for EV Charging and ESS applications

The REF-DAB11KIZSICSYS is a CLLC resonant DC/DC converter board able to provide up to 11 kW at 800 V output voltage. With its highly efficient bi-directional power flow capability and soft switching characteristics it is the ideal building block to speed up the fast prototyping of any EV and ESS charger project.


Control, memory, wireless connectivity and security products

Infineon's XMC7000 series of microcontrollers is designed for high-end industrial uses and provides exceptional compute power via single/dual-core Cortex®-M7 and Cortex®-M0+ cores. They feature low-power 40-nm technology, advanced peripherals like CAN FD, TCPWM, and Gigabit Ethernet for enhanced flexibility and connectivity. With operation temperatures from -40°C to 125°C and power-saving modes reaching 8µA, these MCUs offers high reliability in harsh conditions. The series, including XMC7100 and XMC7200, offers security, operates in critical applications, and comes in TQFP/LFBGA packages with 100-272 pins, all catering to dedicated EV Charging requirements.

XMC7200 Evaluation Kit

The PSoC™ 62 performance line, built on an ultra low-power 40-nm platform, is a combination of Arm® Cortex®-M4 and Arm® Cortex®-M0+ CPUs, with low-power Flash technology, programmable digital and analog resources, and best-in-class CAPSENSE™ technology for touch and proximity applications. This highly integrated MCU helps enable the development of advanced EV charging products having a rich and robust HMI, secure cloud connectivity and an intuitive user experience that a smart home connected device should have.

PSoC™ 62 Performance Line MCUs
PSoC™ 62S2 evaluation kit

The FM25V02A-G as a non-volatile memory with high-speed serial SPI interface and its unlimited write cycle endurance is ideal for use cases that require frequent or fast write operations, such as data logging related to predictive maintenance of EV chargers.


Infineon's ModusToolbox™ is a collection of easy-to-use software and tools that enable rapid development of Infineon microcontrollers and AIROC™ Wi-Fi and Bluetooth® devices. It provides both development tools and run-time software for a flexible and comprehensive development experience. The ModusToolbox™ tools package includes desktop programs that enable the creation of new embedded applications, managing software components, configuring device peripherals and middleware, and embedded development tools for compiling, programming, and debugging. The ModusToolbox™ run-time software includes an extensive collection of GitHub-hosted repositories comprised of code examples, board support packages, middleware, and application support.

The continuous transfer of information essential for overseeing EV charging stations, both nearby and at a distance, underscores the integral role of connectivity in this comprehensive solution. In scenarios that encompass over-the-air firmware updates, live monitoring, secure data exchange, and integration with intelligent home systems, the AIROC™ CYW4373E System on a Chip (SoC) is engineered to bolster EV charging services. This SoC is equipped with dual-band Wi-Fi 5 (802.11ac) that operates on 2.4/5 GHz frequencies, boasts an enhanced range, delivers top-tier RF output, and is operable within a vast temperature window spanning from -40 to +85 degrees Celsius.

For faster development, pre-certified Wi-Fi 5 modules based on the AIROC™ CYW4373 SoC include Murata’s Type 2AE (CYW4373E).

Murata Type 2AE

AIROC™ CYW20829 is a high-performance, ultra-low-power and secured MCU + Bluetooth® LE platform. It combines a high-performance microcontroller with Bluetooth® LE (5.4) connectivity, high-performance analog-to-digital conversion audio input, I2S/PCM, CAN, LIN for automotive use cases and other standard communication and timing peripherals. The CYW20829 in an EV charger, with its highly interoperable BLE stack, enhances the functionality and user experience by enabling remote monitoring and management of the charging process, delivering software updates, enabling contact-less user authentication, payment processing, and access control.

AIROC™ CYW20829 Evaluation Kit

Adding to the security aspects of EV charging, the OPTIGA™ TPM SLB 9673 FW26.xx emerges as the newest member of the OPTIGA™ TPM product line, designed for connected devices necessitating advanced security measures. This standardized and immediately deployable security solution is equipped with an I2C interface and lays a solid groundwork for the verification and authentication of network infrastructure devices, while also safeguarding data integrity and privacy. The OPTIGA™ TPM for EV Charging provides robust security features that act to fortify the entire charging infrastructure against potential threats and vulnerabilities, ensuring that the process of authentication and data protection is both reliable and effective.

OPTIGA™ TPM 9673 RPI Evaluation Board

At Infineon, we are committed to providing the best-in-class solutions to our customers. Our team of experts is always ready to assist you in selecting the right components for your charging infrastructure. With Infineon's comprehensive EV ecosystem solutions, you can build a robust and efficient EV charging infrastructure that meets today's and tomorrow's needs.

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