Low power non-isolated DC/DC switching regulators and isolated converters need to be cost-effective, despite ever-increasing demands for better performance and improved power density. Manufacturers have responded over time with many form-factors that leverage low cost manufacturing, often with a minimal component count with transformers and inductors hand-soldered to traditional PCBs. To minimize the PCB footprint, through-hole SIP versions are often used, though they can complicate the assembly, requiring mixing of wave, or even hand soldering with the reflow process for the other SMT components used on the board.
Although millions of this style of through-hole DC/DC converter are sold each year, a long-term goal for RECOM has been to develop versions which can be handled, placed and soldered like any other modern SMT component, but also with a low profile to match today’s slim-line products. However, the footprint must still remain small to realize the advantages of a module over a discrete design. To achieve this, non-isolated DC/DC switching regulators and isolated converter modules have to utilize the Z direction by integrating 3D assembly techniques.