Apacer massproduce full range of DDR4-3200 wide temperature memory modules

Apacer innovates again by announcing mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules by using Samsung's original wide-temperature grade chips to support cutting-edge platforms including AMD's Ryzen™ Embedded V2000 processor and Intel's Tiger Lake and Elkhart Lake.

Apacer drew on over 20 years of experience to create a full range of DDR4-3200 modules in the UDIMM, SODIMM, ECC UDIMM, ECC SODIMM, and RDIMM form factors. 8GB, 16GB and 32GB capacities are all available. Value-adding features such as anti-sulfuration, conformal coating and underfill can all be added to protect them from corrosion, moisture, vibration, dust and thermal shock. From end to edge to cloud, Apacer's full range of wide-temperature memory modules will significantly improve the stability and reliability of systems for long-term operation in harsh environments.

Apacer is one of the few industrial memory manufacturers that insists on using original factory-specification wide-temperature ICs, and strictly selects top-quality materials (DRAM, PCB, Resistors, and Capacitors) to ensure products operate smoothly at temperatures as low as -40 degrees C or as high as +85 degrees C. By using industrial-grade wide-temperature-range passive parts with 30μ" gold plating PCB, it improves anti-oxidation and ensures stability of signal transmission. A full range of DDR4-3200 module have passed industrial verification testing for high/low temperatures and the most stringent 48-hour thermal cycling test, ensuring their ability to operate for long hours in extreme environments.

Applications: AIoT / Outdoor Embedded and Edge Devices / Networked Communication Systems / Telecommunication Systems / Cloud Equipment

DRAM - DDR4 3200 Wide Temp. UDIMM
  • On-DIMM thermal sensor : No
  • Package: 288-pin socket type dual in-line memory module (DIMM)
  • PCB: height 31.25mm, lead pitch 0.85mm (pin)
  • VDDQ = 1.2V (1.14V to 1.26V)
  • Average refresh period
  • 7.8µs at 0°C TC 85°C
  • 3.9µs at 85°C TC 95°C
  • Lead-free (RoHS compliant)
  • Halogen free
  • Operating case temperature range: Industrial (-40°C ≤ TC ≤ +85°C)
  • PCB: 30μ gold finger
  • Conformal coating/Underfill (optional)
DRAM - DDR4 3200 Wide Temp. SODIMM
    • On-DIMM thermal sensor : No
    • Package: 260-pin socket type small outline dual in-line memory module(SO-DIMM)
    • PCB: height 30.0mm, lead pitch 0.50mm (pin),
    • VDDQ = 1.2V (1.14V to 1.26V)
    • Average refresh period
    • 7.8µs at 0°C TC 85°C
    • 3.9µs at 85°C TC 95°C
    • Lead-free (RoHS compliant)
    • Halogen free
    • Operating case temperature range: Industrial (-40°C TC +85°C)
    • PCB: 30μ gold finger
    • Conformal coating/Underfill (optional)

    DRAM - DDR4 3200 Wide Temp. RDIMM
        • Support ECC error detection and correction
        • On-DIMM thermal sensor: Yes
        • Package: 288-pin socket type dual in-line memory module (REG DIMM)
        • 16 internal banks
        • VDDQ = 1.2V (1.14V to 1.26V)
        • TC of 0°C to 85°C
        • 64ms, 8192-cycle refresh at 0°C to 85°C
        • 32ms at 85°C to 95°C
        • Lead-free (RoHS compliant)
        • Halogen free
        • Operating case temperature range: Industrial (-40 °C ≤ TC ≤ +85°C)
        • PCB: 30μ gold finger
        • Conformal coating/Underfill (optional)

        DRAM - DDR4 3200 Wide Temp. ECC UDIMM
        • Support ECC error detection and correction
        • On-DIMM thermal sensor : Yes
        • Package: 288-pin socket type dual in-line memory module (ECC UDIMM)
        • PCB: height 31.25mm, lead pitch 0.85mm (pin),
        • 16 internal banks (4 bank groups)
        • Average refresh period
        • 7.8µs at 0°C TC 85°C
        • 3.9µs at 85°C TC 95°C
        • Lead-free (RoHS compliant)
        • Halogen free
        • Operating case temperature range: Industrial (-40°C TC ≤ +85°C)
        • PCB: 30μ gold finger
        • Conformal coating/Underfill (optional)

        DRAM - DDR4 3200 Wide Temp. ECC SODIMM
        • Support ECC error detection and correction
        • On-DIMM thermal sensor : Yes Package: 260-pin socket type small outline dual in-line memory module (ECC SO-DIMM)
        • PCB: height 30.0mm, lead pitch 0.50mm (pin)
        • Power Supply: VDD=1.2V (1.14V to 1.26V)
        • 16 internal banks (4 bank groups)
        • Average refresh period
        • 7.8µs at 0°C ≦ TC ≦ 85°C
        • 3.9µs at 85°C ≦ TC ≦ 95°C
        • Lead-free (RoHS compliant)
        • Halogen free
        • Operating case temperature range: Industrial (-40 °C ≤ TC ≤ +85°C)
        • PCB: 30μ gold finger
        • Conformal coating/Underfill (optional)

        Value-added Technologies:

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