Robots have been an essential part of the production process for high volume goods for a very long time. However, when there is a non-standard working environment, where it has to deal with many different materials, shapes, context specific tasks, it did not have any economic value to introduce too much automation and therefore the work was done manually.
Along with the version update v.1.4.0 for the Synergy Software Package (SSP),
Renesas releases a new group of microcontrollers for the SSP. The S3A1 group is ideally suited for all applications that require a high level of security and IoT device-to-cloud connectivity. It is now available from stock at www.Rutronik24.com.
As planar NAND flash technology has reached its physical scaling limits and further die shrinking would come along with a decrease in reliability and higher costs, 3D NAND was developed by vertically stacking cells in several layers.
Thanks to the new S-VSON technology, the G3VM series from Omron is
characterized by a very small form factor. It is suitable in particular for high current and low on-resistance.
The Intel® Core™ i7+ and Core™ i5+ Boxed Solutions combine Intel Core processors of the eighth generation with Intel Optane technology. This results in complete packages that bring
significant performance boost to both notebooks and desktop PCs. They are available at
www.Rutronik24.com as of now.