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Now at Rutronik: The S3A1 Microcontroller Group for the Renesas Synergy Software Package

Created by Zibo Su |   Knowledge

Along with the version update v.1.4.0 for the Synergy Software Package (SSP),

Renesas releases a new group of microcontrollers for the SSP. The S3A1 group is ideally suited for all applications that require a high level of security and IoT device-to-cloud connectivity. It is now available from stock at www.Rutronik24.com.

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Transcend 3D-Nand

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As planar NAND flash technology has reached its physical scaling limits and further die shrinking would come along with a decrease in reliability and higher costs, 3D NAND was developed by vertically stacking cells in several layers.

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Rutronik presents the new generation of MOSFET relays from Omron

Created by Norman Majer |   Knowledge

Thanks to the new S-VSON technology, the G3VM series from Omron is

characterized by a very small form factor. It is suitable in particular for high current and low on-resistance.

 

 

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New at Rutronik: Intel® Core™ i7+ and Core™ i5+ Boxed Solutions

Created by Mario Klug |   Knowledge

The Intel® Core™ i7+ and Core™ i5+ Boxed Solutions combine Intel Core processors of the eighth generation with Intel Optane technology. This results in complete packages that bring

significant performance boost to both notebooks and desktop PCs. They are available at

www.Rutronik24.com as of now.

 

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LTE-M / NB-IoT multimode-module by Nordic at Rutronik

Created by Sarah Brucker |   Knowledge

Nordic Semiconductor‘s nRF91 series enables IoT applications to be easily and securely connected via the LTE-M and NB-IoT mobile communications standards designed specifically for IoT. With its small dimensions, high security standards and extremely low power consumption, the multi-mode module is the ideal solution for devices that need a battery-powered cellular connection.

 

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