As planar NAND flash technology has reached its physical scaling limits and further die shrinking would come along with a decrease in reliability and higher costs, 3D NAND was developed by vertically stacking cells in several layers.
Contract manufacturing offers many benefits, particularly lower costs and greater flexibility. A major disadvantage is the risk of espionage and/or the copying of production data. Special programming systems help to keep control of in-house data and prevent illegal copies.
Thanks to the new S-VSON technology, the G3VM series from Omron is
characterized by a very small form factor. It is suitable in particular for high current and low on-resistance.
Bluetooth technology plays a major role in the Internet of Things (IoT) – with 8.2 billion Bluetooth-equipped smartphones, Bluetooth headsets and other Bluetooth devices already in use today. With Bluetooth 5, this is set to grow massively.
The Intel® Core™ i7+ and Core™ i5+ Boxed Solutions combine Intel Core processors of the eighth generation with Intel Optane technology. This results in complete packages that bring
significant performance boost to both notebooks and desktop PCs. They are available at
www.Rutronik24.com as of now.