Along with the version update v.1.4.0 for the Synergy Software Package (SSP),
Renesas releases a new group of microcontrollers for the SSP. The S3A1 group is ideally suited for all applications that require a high level of security and IoT device-to-cloud connectivity. It is now available from stock at www.Rutronik24.com.
As planar NAND flash technology has reached its physical scaling limits and further die shrinking would come along with a decrease in reliability and higher costs, 3D NAND was developed by vertically stacking cells in several layers.
Contract manufacturing offers many benefits, particularly lower costs and greater flexibility. A major disadvantage is the risk of espionage and/or the copying of production data. Special programming systems help to keep control of in-house data and prevent illegal copies.
Thanks to the new S-VSON technology, the G3VM series from Omron is
characterized by a very small form factor. It is suitable in particular for high current and low on-resistance.
Bluetooth technology plays a major role in the Internet of Things (IoT) – with 8.2 billion Bluetooth-equipped smartphones, Bluetooth headsets and other Bluetooth devices already in use today. With Bluetooth 5, this is set to grow massively.