Knowledge

Knowledge

The New AE-CLOUD2 Kit from Renesas: Easily Connect IoT Devices to Cloud Services

Created by Zibo Su |   Suppliers

The newly introduced AE-CLOUD2 Kit from Renesas connects IoT applications

with cloud services such as Amazon Web Services, Google Cloud Platform and Microsoft Azure.

Unlike the AE-CLOUD1 Kit, which was released in spring 2018, AE-CLOUD2 also uses the new cellular

technologies NB-IoT and Cat-M1. It is available as of now at www.Rutronik24.com

Read more

Rutronik partner Alliance Memory continues to offer discontinued Cypress SRAMS

Created by Isabell Weinlein |   Knowledge

Good news for customers of Rutronik Elektronische Bauelemente GmbH: Alliance Memory, a manufacturer from the Rutronik portfolio continues to offer some of the low-power SRAMs of the CY62256 series discontinued by Cypress Semiconductor Corporation. Alliance Memory aims to ensure the supply of the components until 2019.

Read more

The New AE-CLOUD2 Kit from Renesas: Easily Connect IoT Devices to Cloud Services

Created by Zibo Su |   Knowledge

The newly introduced AE-CLOUD2 Kit from Renesas connects IoT applications with cloud services such as Amazon Web Services, Google Cloud Platform and Microsoft Azure. Unlike the AE-CLOUD1 Kit, which was released in spring 2018, AE-CLOUD2 also uses the new cellular technologies NB-IoT and Cat-M1. It is available as of now at www.Rutronik24.com.

Read more

What is the difference between 2D NAND, 3D NAND and 3D XPoint flash memory?

Created by Patrick Twele, Product Sales Manager Storage, Rutronik Elektronische Bauelemente GmbH |   Knowledge

Flash memory has supplanted other memory technologies in almost all market segments. Its success can be attributed to cost reduction through structure minimization, more information saved per cell thanks to various voltage levels (MLC and TLC flash memory), and new software features.

Read more

Rutronik (C3-312 and C4-434) demonstrates sensor package from ST for predictive maintenance applications

Created by Stephan Menze |   Knowledge

The ISM330DLC from STMicroelectronics is a SiP (System-in-Package) with a

digital 3D acceleration sensor and a digital 3D gyroscope tailored for industrial 4.0 applications. It is the

core of Rutronik‘s predictive maintenance demo at electronica.

Read more