Knowledge

Knowledge

For high operating temperatures up to +155°C: Commercial IHLP inductor in 7575 package from Vishay at Rutronik

  Knowledge

Convincing parameters: Intended for computer, telecommunications and industrial applications, Vishay Dale's IHLP 7575GZ-51 inductor offers up to 30% smaller DCR values and up to 35% higher current-carrying capacity compared to components in the 6767 package. It also offers a 50% cost savings potential compared to those in the 8787 package. In addition, it is specified for operating temperatures up to...

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Intel Atom x6000E processor series - Combining the best of many worlds

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The Intel Atom x6000E processor series, codenamed “Elkhart Lake” (EHL), is the latest member of the processor family and features capabilities for a wide range of industrial applications. As a system-on-a-chip (SoC), it contains numerous I/Os that have never before been available on an Intel SoC.

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Higher current-carrying capability for lower BOM: Infineon StrongIRFET™ 2 Power MOSFETs in Rutronik‘s power portfolio

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Parallel connection of multiple devices becomes unnecessary: The new StrongIRFET™ 2 power MOSFETs in 80 V and 100 V are the latest generation of Infineon‘s MOSFET technology for a wide range of applications and are suitable for both low and high switching frequencies. This new technology offers 40 percent improved RDS(on) and over 50 percent lower gate charge (Qg) compared to previous StrongIRFET™ devices....

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Power MOSFETs meeting all design requirements by Infineon

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Being the manufacturer with the largest portfolio, Infineon offers low power MOSFETs with broad product availability, convenience of choice, and ease of design. The selected portfolio of low power MOSFETs offers simple and price-competitive solutions that have wide availability and established quality. The portfolio covers voltage classes up to 100V. It includes single and dual N-channel MOSFETs as well as...

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NAND Flash Architectures - What Comes After 2D SLC NAND Flash?

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2D SLC NAND is currently still the reigning champion when it comes to interchangeable storage media. But the 43nm generation will soon be discontinued, and smaller 24nm structures will suffer the same fate in the medium term, so developers should start looking at possible alternatives.

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