New Bluetooth standards, IoT and 5G applications, and display technologies – Rutronik Elektronische Bauelemente GmbH’s appearance at embedded world (Hall 5, booth 467) from Tuesday, February 25 to Thursday, February 27, 2020 in Nuremberg, Germany, will be centered around these key topics.
Rutronik Elektronische Bauelemente GmbH is expanding its portfolio with products from HMS Industrial Networks, a manufacturer of solutions for industrial communication and the Internet of Things. The companies have entered into a global distribution agreement.
The HCB-Rutronik Racing team, sponsored by Rutronik Elektronische Bauelemente GmbH, will once again compete in the FIA GT World Cup in Macao (Thursday, November 14 to Sunday, November 17) as the official Audi works team, just like it did in 2018. ADAC GT Masters winner Kelvin van der Linde will sit in the cockpit of the Audi R8 LMS GT 3 for the “Audi Sport Team Rutronik.”
The new Nordic Semiconductor multiprotocol SoC (System on Chip) nRF52833 supports Bluetooth 5.1, Bluetooth Mesh, 802.15.4, Thread, ZigBee and proprietary 2,4GHz protocols. For developments based on the nRF52833 there is also a flexible single-board Development Kit (DK) available at www.rutronik24.com.