FCI announces the successful demonstration of a 20+ Gb/s data stream over its new ultra-high density TwinMezz(TM) mezzanine connector system, which has also been named a finalist in the 2010 DesignVision Awards program in the Interconnect Technologies and Components category by the International Engineering Consortium (IEC). The TwinMezz(TM) connector system provides superior electrical performance at the highest data rates, the highest signal density, and the lowest insertion force when compared to other available mezzanine connectors.

The TwinMezz connectors exhibit very well-matched impedance, low insertion loss, and low crosstalk, which make them well-suited for applications in very high-speed environments.

Configurations with six differential signal pairs per column provide maximum signal density, delivering 25 high-speed signal pairs in a square centimeter, or 161 signal pairs in a square inch. The innovative hermaphroditic design mates to itself and supports stack heights ranging from 12mm to 40mm with 200 to 800 total contacts.

The TwinMezz connector system provides exceptional flexibility with options for integrated molded or optional metal guides and the capability to mix signal and power wafers in a single connector. The versatile open pin field design offers additional flexibility by allowing for mixed differential, single-ended or power pin assignments in a single connector. TwinMezz connectors also feature FCI's patented BGA connector termination for easy surface-mount attachment and efficient trace routing. For more information, visit www.fciconnect.com/twinmezz.

The TwinMezz(TM) connector system, along with other leading edge high-speed and power products from FCI, will be displayed February 2-3 in booth #515 at the DesignCon conference and exhibition in Santa Clara, CA. DesignVision Award winners will be announced at the conference on February 2.